C1608X7R2A105KT0A0E 代理TDK
-
尺寸
長度(L) |
- 1.60mm +0.20,-0.10mm
|
寬度(W) |
- 0.80mm +0.20,-0.10mm
|
厚度(T) |
- 0.80mm +0.20,-0.10mm
|
端子寬度(B) |
- 0.20mm Min.
|
端子間隔(G) |
- 0.30mm Min.
|
推薦焊盤布局(PA) |
- 0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
|
推薦焊盤布局(PB) |
- 0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
|
推薦焊盤布局(PC) |
- 0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
|
電氣特性
電容 |
- 1μF ±10%
|
額定電壓 |
- 100VDC
|
溫度特性  |
- X7R(±15%)
|
耗散因數(shù) (Max.) |
- 5%
|
絕緣電阻 (Min.) |
- 100MΩ
|
其他
溫度范圍 |
- -55~125°C
|
焊接方法 |
- 流體
- 回流
|
AEC-Q200 |
- NO
|
包裝形式 |
- 編帶 (180mm卷筒)
|
包裝個數(shù) |
- 4000pcs
|
